Diamond wheel with the removal process is generally similar to the laser processing of materials. Laser light dressing diamond grinding wheel, binder material removal process is also subject to absorption of laser radiation and solar energy, solar energy conversion and material is heated, material damage or removal of several stages. Diamond grinding wheel when the laser trimming, part of the molten metal in the wheel without removing and re-form end product, or adhering a covering on a part of the diamond abrasive grains, and the formation of a number of metal protrusions. At the beginning of grinding, only a small amount of wheel table and participate grinding up grains, grinding wheel performance is unstable, and therefore less grinding force.

    Diamond grinding wheel after a short time, the higher the grit off or broken, so that part of the contact metal binding agent specimen projections and product increased, highlighting the metal surface of the specimen and the grinding force of friction increases with the progress of the grinding process, highlighting the metal part attached to the abrasive grains and metals are gradually worn out, the number of abrasive wheel cutting table and participate in the increase, diamond grinding wheel performance stabilized, so, grinding force and grinding the surface roughness decreases. Since laser dressing diamond grinding wheel after a larger table and prominent height and chip space; therefore able to maintain a long steady grinding wheel grinding time.

Laser plus efficient than other methods.

Laser processing features:

1, diamond grinding wheel machining tools laser processing is not required, a non-contact machining, tool wear and tear problems and there are no suitable automation.

2, laser due to the high density diamond grinding wheel speed, high efficiency and small heat-affected zone, diamond grinding wheel plus almost all of the material (such as metal materials, ceramics, quartz, diamond, etc.).